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  1. 1
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    Reflow soldering : apparatus and heat transfer processes /
  2. 2
    by Lee, Ning-Cheng
    Published 2002
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    Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
  3. 3
    Published 2007
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    Lead-free soldering /
  4. 4
    by Pang, John Hock Lye
    Published 2012
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    Lead free solder : mechanics and reliability /
  5. 5
    Published 1993
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    ASM Handbooks Online
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    Welding, brazing, and soldering /
  6. 6
    Published 2020
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    Learning Soldering for Electronics /
  7. 7
    Published 2012
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    Wiley Online Library
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    Lead-free solders : materials reliability for electronics /
  8. 8
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    Solder Joint Reliability Prediction for Multiple Environments.
  9. 9
    Published 2011
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    The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects /
  10. 10
    Published 2020
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    Lead-free soldering process development and reliability /
  11. 11
    by Lau, John H., Lee, Ning-Cheng
    Published 2020
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    Assembly and reliability of lead-free solder joints /
  12. 12
    Ejournal
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    Emerald: 01/01/1989 to Present
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    Soldering & surface mount technology.
  13. 13
    Published 2007
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    Lead-free electronic solders : a special issue of Journal of Materials Science: Materials in Electronics /
  14. 14
    by Evans, John W., 1957-
    Published 2007
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    A guide to lead-free solders : physical metallurgy and reliability /
  15. 15
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    Springer eBooks
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    Fundamentals of lead-free solder interconnect technology : from microstructures to reliability /
  16. 16
    Published 2022
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    Recent progress in lead-free solder technology : materials development, processing and performances /
  17. 17
    by Suhir, Ephraim
    Published 2021
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    Avoiding inelastic strains in solder joint interconnections of IC devices /
  18. 18
    by Li, Yi, Lu, Daniel, Wong, C. P., 1947-
    Published 2010
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    Electrical conductive adhesives with nanotechnologies /
  19. 19
    by Heinemann, Christian
    Published 2014
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    Phase separation coupled with damage processes : analysis of phase field models in elastic media /
  20. 20
    by Zhang, Qingke
    Published 2016
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    Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces /
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