Conference
Effect of solder joint volume on its shear fracture mode
| Title: | Effect of solder joint volume on its shear fracture mode |
|---|---|
| Authors: | Garami, Tamas, Krammer, Oliver |
| Source: | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2015 IEEE 21st International Symposium for. :89-93 Oct, 2015 |
| Relation: | 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| DOI: | 10.1109/SIITME.2015.7342301 |
| Database: | IEEE Xplore Digital Library |