Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices / L.T. Yeh, R.C. Chu.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide ra...
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| Format: | Ebook |
| Language: | English |
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New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) :
American Society of Mechanical Engineers,
2002.
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| Series: | ASME Press book series on electronic packaging.
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| Online Access: | American Society of Mechanical Engineers |
| Summary: | With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. |
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| Item Description: | Title from PDF title page (ASME eBooks Web site, viewed 12/04/2010). |
| Physical Description: | 1 online resource (xxi, 414 pages) : illustrations |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780791801680 |