2nd International Congress of Electrical and Computer Engineering / Muhammet Nuri Seyman, editor.
This proceedings presents the papers included in the 2nd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 22-25 November 2023. The conference aims to bring together researchers, developers, and students in computing, technology trends, ar...
I tiakina i:
| Kaituhi rangatōpū: | |
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| Ētahi atu kaituhi: | |
| Hōputu: | iPukapuka |
| Reo: | English |
| I whakaputaina: |
Cham :
Springer,
[2024]
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| Rangatū: | EAI/Springer innovations in communication and computing
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| Ngā marau: | |
| Urunga tuihono: | Springer eBooks |
| Whakarāpopototanga: | This proceedings presents the papers included in the 2nd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 22-25 November 2023. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG’23 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching. Presents papers from the 2nd International Congress of Electrical and Computer Engineering (ICECENG 2023); Brings together researchers, developers, and students in computing, technology trends, artificial intelligence, and security; Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE. |
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| Whakaahutanga tūemi: | International conference proceedings. Includes index. |
| Whakaahuatanga ōkiko: | 1 online resource (ix, 413 pages) : illustrations (chiefly colour). |
| ISBN: | 9783031527609 3031527607 |
| ISSN: | 2522-8609 |